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Engineering Summer Education Program, School of Engineering, UTokyo

Thursday - 02/02/2023 05:48
Engineering Summer Education Program, School of Engineering, UTokyo

The summer program at School of Engineering at the University of Tokyo, called ESEP (Engineering Summer Education Program), is an opportunity for undergraduate and graduate students to participate in scientific research projects at world-leading laboratories at the University of Tokyo. Students from partner universities are eligible to participate.

HUST belongs to program ESEP-G (June 26th - August 4th, 2023) : Six-week intensive program

Eligibility

Applicants must be full-time students enrolled at one of the partner universities.

・Undergraduate students who have completed at least 2 full years in a bachelor’s degree program before the program starts

・Graduate students

Program duration : June 26th – August 4th, 2023

Number of participants : Up to 20 students

Location : Hongo main campus (in principle)

Program fee : Free

Application period : November 21st, 2022 - January 11th, 2023

Host labs :

Students will be hosted by one of the laboratories. Any special academic requirements for training in each lab are also indicated on the list.

Selection result : Middle of March 2023

Applicants must:

  1. participate in the entire duration of the program
  2. have high rated academic performance and a high level of English proficiency
  3. have a strong interest in pursuing a Ph. D
  4. remain enrolled at their current home university during the program period. When an applicant is in the last year of their degree program, the graduation must be taken place after the program ends
  5. not have joined this program before
  6. make a final report and submit it to School of Engineering at the conclusion of the program
  7. secure overseas travel insurance in their home countries before coming to Japan, and bear the premium of personal liability insurance (see "Insurance" for details)
  8. refrain from attending other courses and being employed
  9. respect the work of all laboratory members and participate in activities in the laboratory
  10. understand and agree with the "Important notice regarding Covid-19"

Financial support :

Based on the ESEP Scholarship guideline of the School of Engineering, The University of Tokyo, JPY 160,000 (JPY 80,000 monthly × 2 months) will be provided to participants who meet the following requirements. The scholarship will be paid on a monthly basis in cash.

  • participating in the entire duration of the program
  • staying in the accommodation (see "Accommodation" below) provided by the program
  • attending all required activities and social events
  • submitting a final report to the School of Engineering at the end of the program

NOTE: Participants must bear the following costs:

  • Air ticket (round-trip ticket)
  • Overseas travel insurance and personal liability insurance
  • Visa fee, domestic transportation fee, and any costs related to COVID-19 when entering Japan
  • Daily commuting expenses for coming to campus from the accommodation
  • Everyday living expenses

Insurance :

1) Selected students must pay a personal liability insurance premium on the first day of the program in Japan. This insurance will cover any unintentional accidents involving another person and/or laboratory equipment while in training. The premium will cost about JPY 5,000 per person.

2) Selected students must be covered by their own travel insurance for the entire duration of their stay in Japan and must submit copies of their insurance policy to us.

Accommodation :

Designated accommodations will be provided free of charge to students during of the program. The details will be announced after the selection process.

Important Notice regarding COVID-19 :
If the travel restrictions and quarantine measures due to the influence of COVID-19 are in effect as of the following date:
・ESEP-G: March 1st, 2023

1. Students from the relevant country/region are NOT allowed to come to Japan. There will be no postponement nor re-opening.
2. Only those laboratories offering both in-person and online courses will allow students to switch from in-person courses to online courses upon confirming their intentions with the host supervisor. No scholarship will be paid for students taking online courses.
3. The scheduled events such as Japanese culture classes and tours will be subjected to change.
 
Poster 
 
Past program reports




HOW TO APPLY

Application deadline

ESEP-G 3:00 pm on January 11th, 2023 (Japan time)

  1. Applications are only accepted via the online application system T-cens First, you need to create an account and ID to start filling it in.

    Please refer to for your T-cens application.

    Required documents to upload

    NOTE: Submitted documents should be clear and readable.

      • Photo : must have been taken in the last 6 months
      • Photocopy of the photo page of your valid passport
      • Photocopy of your current student ID card
      • Official certificate of current enrollment*
      • Official Undergraduate academic transcript*(both undergraduate students and graduate students)
      • Official Graduate academic transcript*(graduate students only)
      • Test scores report (IELTS/TOEIC/TOEFL/ other external tests)

        Exemption: those whose nationality is USA, UK, Canada, Australia, New Zealand, Ireland or currently enrolled at a university in those countries and students of ESEP-INDIA.

      • Personal statement (for ESEP-G)
      • Personal statement ( for ESEP-INDIA)
      • Letter of recommendation ()
        The letter must be issued by applicant’s supervising faculty member. Applicants need to ask the supervisor to upload the letter directly to the T-cens. Please refer to the “” guide.
    1. The documents with the sign* must have been issued in the last 6 months.
Contact:
Office of International Cooperation and Exchange (OICE)
School of Engineering
The University of Tokyo
7-3-1 Hongo Bunkyo-ku, Tokyo, Japan 113-8656
E-mail: [email protected]

HUST: Ms. Mai Chi | Email: [email protected] | Room C1-212, HUST.

Q&A and other information: 
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